Porous Silicon Wafer Etching

Starting with 6" <1-0-0> Cz p-type Si Wafers >300µm thickness:

Micro-, Meso- and Macroporous Silicon can be etched to a certain thickness, pore size and porosity.  Categories are divided below.

Microporous Etching           ( 1-5nm Pore Diameters)
Mesoporous Etching          ( 5-50nm Pore Diamters)
Macroporous Etching         ( >50nm Trenches or Vias)

n type Si can also be used upon request, but we do not yet have the capability to use an added light source for +hole creation.