Porous Silicon Wafer Etching
Starting with 6" <1-0-0> Cz p-type Si Wafers >300µm thickness:
Micro-, Meso- and Macroporous Silicon can be etched to a certain thickness, pore size and porosity. Categories are divided below.
Microporous Etching ( 1-5nm Pore Diameters)
Mesoporous Etching ( 5-50nm Pore Diamters)
Macroporous Etching ( >50nm Trenches or Vias)
n type Si can also be used upon request, but we do not yet have the capability to use an added light source for +hole creation.